FWF39602-S11B22W1B Wafer 3.96mm 90°Angle 11Circuits (DIP)(HF)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications：

Product specification.pdf

Sales Drawings：

FWF39602.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF39602-S11B22W1B
Category：	Wire to Board Connectors
Specification：	Pitch:3.96mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	90° Angle
Circuits：	11Circuits
Status：	Active
Description：	Wafer 3.96mm 90°Angle 11Circuits (DIP)(HF)
Stock(pcs)：	50
Lead time：	50 In stock Estimated delivery date when out of stock 2026-02-07
MPQ：	1000
MOQ：	10000
Type：	Wafer 3.96mm 90°Angle (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (DIP)
Pitch	3.96mm
Height	9.4mm
Electrical
Current - Maximum per Contact	7.00A
Voltage - Maximum	250V
Contact Resistance	10 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1500V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA6T UL94V-0/PA66 UL94V-0