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FWF39603-S05S22TB

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF39603 series.pdf
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Product number: FWF39603-S05S22TB
Category: Wire to Board Connectors
Specification: Pitch:3.96mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 5Circuits
Status: Active
Description: Wafer 3.96mm 180°Vertical 5Circuits (DIP)
Stock(pcs): 1011
Lead time: 1011 In stock
Estimated delivery date when out of stock 2024-12-03
MPQ: 1000
MOQ: 1000
Type: Wafer 3.96mm 180°Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 3.96mm
Height 12.6mm
Electrical
Current - Maximum per Contact 6.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
F0JL24-P30SW000-01
JL24 ,Plug ,30Circuits ,180°Vertical ,Soldering
FHG30003-D06F2K6B
Wire to board housing 3mm 6Circuits
FPH20072-D12S1014110921M
Pin Header 2mm ,Double row ,12Circuits ,180° Vertical(SMT) ,1μ" ,PA6T
FWF12506-S15S24W5B
Wafer 1.25mm 180°Vertical 15Circuits (DIP)
FWF25404-S05S12K6B
Wafer 2.54mm 180°Vertical 5Circuits (DIP)
FWF39602-S05B22W1B
Wafer 3.96mm 90°Angle 5Circuits (DIP)(HF)
Quantity Unit Price
1 $0.094700
10 $0.088626
50 $0.076476
100 $0.070401
500 $0.058251
1000 $0.038527
2500 $0.038001
5000 $0.037475
10000 $0.036949
25000 $0.036423

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Sales Drawings

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