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FWF39603-S09S22TB

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF39603 series.pdf
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Product number: FWF39603-S09S22TB
Category: Wire to Board Connectors
Specification: Pitch:3.96mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 9Circuits
Status: Active
Description: Wafer 3.96mm 180°Vertical 9Circuits (DIP)
Stock(pcs): 1750
Lead time: 1750 In stock
Estimated delivery date when out of stock 2024-12-03
MPQ: 1000
MOQ: 1000
Type: Wafer 3.96mm 180°Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 3.96mm
Height 12.6mm
Electrical
Current - Maximum per Contact 6.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
FFC05009-52SSA124W5M
FPC/FFC connector 0.5mm 52Circuits(SMT)
FFH12705-D10S1004K6M
Female Header 1.27mm 180°Vertical Double Row 10Circuits(SMT)
FFH25405-T39S1004K6K
Female Header 2.54mm ,Three row ,39Circuits ,180° Vertical(DIP) ,PA6T
FHG20011-S03M2W1B
Wire to board housing 2mm 3Circuits
FHG62006-T12M2TB
Wire to board housing 6.2mm 12Circuits
FWF30005-S11B22K6B
Wafer 3mm 90°Angle 11Circuits(DIP)
Quantity Unit Price
1 $0.143184
10 $0.134690
50 $0.117701
100 $0.109206
500 $0.092218
1000 $0.068518
2500 $0.067579
5000 $0.066641
10000 $0.065702
25000 $0.064764

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Sales Drawings

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