FWF39603-S11S22TB Wafer 3.96mm 180°Vertical 11Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

FWF39603 series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF39603-S11S22TB
Category：	Wire to Board Connectors
Specification：	Pitch:3.96mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	180°Vertical
Circuits：	11Circuits
Status：	Active
Description：	Wafer 3.96mm 180°Vertical 11Circuits (DIP)
Stock(pcs)：	0
Lead time：	Estimated delivery date 2025-07-11
MPQ：	500
MOQ：	1000
Type：	Wafer 3.96mm 180°Vertical (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 180°Vertical (DIP)
Pitch	3.96mm
Height	12.6mm
Electrical
Current - Maximum per Contact	6.00A
Voltage - Maximum	250V
Contact Resistance	10 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1500V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA66 UL94V-0