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FWF39603-S11S22TB

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF39603 series.pdf
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Product number: FWF39603-S11S22TB
Category: Wire to Board Connectors
Specification: Pitch:3.96mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 11Circuits
Status: Active
Description: Wafer 3.96mm 180°Vertical 11Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2025-01-02
MPQ: 500
MOQ: 1000
Type: Wafer 3.96mm 180°Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 3.96mm
Height 12.6mm
Electrical
Current - Maximum per Contact 6.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
FBB08001-F60S1003K6MH35
Board to Board 180°Vertical 0.8mm 60Circuits(H1=3.5mm)
FFC05012-04SSB124W5M
FPC/FFC connector 0.5mm 4Circuits(SMT)
FFC10003-10SBB124W5M
FPC/FFC connector 1mm (H2) ,10Circuits ,90° Angle(SMT) ,Bottom contact ,PA9T
FFH10001-D24S1004K6K
Female Header 1mm 180°Vertical Double row 24Circuits(SMT)
FFH25461-D20S1004BKK
Female Header 2.54mm ,Double row ,20Circuits ,180° Vertical(DIP),Gold flash,PA6T
Quantity Unit Price
1 $0.172074
10 $0.161866
50 $0.141449
100 $0.131241
500 $0.110824
1000 $0.082343
2500 $0.081215
5000 $0.080087
10000 $0.078959
25000 $0.077831

* Please jump to latest version page view prices for purchasing

Sales Drawings

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