FWF39603-S12S22TB Wafer 3.96mm 180°Vertical 12Circuits (DIP)

✖

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

FWF39603 series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

Export Page to PDF

Product number：	FWF39603-S12S22TB
Category：	Wire to Board Connectors
Specification：	Pitch:3.96mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	180°Vertical
Circuits：	12Circuits
Status：	Active
Description：	Wafer 3.96mm 180°Vertical 12Circuits (DIP)
Stock(pcs)：	50
Lead time：	50 In stock Estimated delivery date when out of stock 2024-11-18
MPQ：	500
MOQ：	1000
Type：	Wafer 3.96mm 180°Vertical (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 180°Vertical (DIP)
Pitch	3.96mm
Height	12.6mm
Electrical
Current - Maximum per Contact	6.00A
Voltage - Maximum	250V
Contact Resistance	10 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1500V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA66 UL94V-0

Quantity

Unit Price

$0.191390

$0.180036

$0.157327

100

$0.145973

500

$0.123265

1000

$0.091586

2500

$0.090332

5000

$0.089077

10000

$0.087822

25000

$0.086568