FWF39604-S07B22TB Wafer 3.96mm 90°Angle 7Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

FWF39604 series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF39604-S07B22TB
Category：	Wire to Board Connectors
Specification：	Pitch:3.96mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	90° Angle
Circuits：	7Circuits
Status：	Active
Description：	Wafer 3.96mm 90°Angle 7Circuits (DIP)
Stock(pcs)：	230
Lead time：	230 In stock Estimated delivery date when out of stock 2024-11-17
MPQ：	500
MOQ：	1000
Type：	Wafer 3.96mm 90°Angle (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (DIP)
Pitch	3.96mm
Height	12.6mm
Electrical
Current - Maximum per Contact	6.00A
Voltage - Maximum	250V
Contact Resistance	10 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1500V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA66 UL94V-0

Quantity

Unit Price

$0.149378

$0.140516

$0.122793

100

$0.113931

500

$0.096207

1000

$0.071482

2500

$0.070503

5000

$0.069524

10000

$0.068545

25000

$0.067566