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FWF39604-S08B22TB

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF39604 series.pdf
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Product number: FWF39604-S08B22TB
Category: Wire to Board Connectors
Specification: Pitch:3.96mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 8Circuits
Status: Active
Description: Wafer 3.96mm 90°Angle 8Circuits (DIP)
Stock(pcs): 950
Lead time: 950 In stock
Estimated delivery date when out of stock 2025-12-24
MPQ: 500
MOQ: 1000
Type: Wafer 3.96mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 3.96mm
Height 12.6mm
Electrical
Current - Maximum per Contact 6.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
FBB05002-M28S1003K6MH08
Board to Board 180°Vertical 0.5mm 28Circuits(H2=0.8mm)
FHG20007-D24M2W1B
Wire to board housing 2mm 24Circuits
FID20004-444K6K
IDC 2.0mm 44Circuits(3 Assemblies)
FID25408-204K6K
IDC 2.54mm 20Circuits(3 Assemblies)
FPH20045-S04S1004070715B
Pin Header 2.00mm ,Single row ,4Circuits ,180° Vertical(DIP) ,Gold flash ,PA6T
FPH200S5-S40S100403B
Pin Header 2.0mm 180°Vertical Single row 40Circuits(DIP)
Quantity Unit Price
1 $0.172342
10 $0.162118
50 $0.141670
100 $0.131445
500 $0.110997
1000 $0.082471
2500 $0.081341
5000 $0.080212
10000 $0.079082
25000 $0.077952

* Please jump to latest version page view prices for purchasing

Sales Drawings

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