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FWF39604-S11B22TB

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF39604 series.pdf
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Product number: FWF39604-S11B22TB
Category: Wire to Board Connectors
Specification: Pitch:3.96mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 11Circuits
Status: Active
Description: Wafer 3.96mm 90°Angle 11Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2025-11-14
MPQ: 500
MOQ: 1000
Type: Wafer 3.96mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 3.96mm
Height 12.6mm
Electrical
Current - Maximum per Contact 6.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
FBH25419-D44S1001K6B02
Box Header 2.54mm 180°Vertical 44Circuits(DIP)
FHG25001-S11M2W1B
Wire to board housing 2.5mm 11Circuits
FHG25005-S08M2W1B
Wire to board housing 2.5mm 8Circuits
FPH20003-S15B100402M
Pin Header 2mm 90°Angle Single row 15Circuits(SMT)
FWF20004-S15B24W5M
Wafer 2mm 90°Angle 15Circuits (SMT)
FWF39601-S04S24W5B
Wafer 3.96mm 180°Vertical 4Circuits(DIP)
Quantity Unit Price
1 $0.234855
10 $0.220922
50 $0.193057
100 $0.179124
500 $0.151259
1000 $0.112386
2500 $0.110846
5000 $0.109307
10000 $0.107767
25000 $0.106227

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Sales Drawings

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