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FWF39604-S12B22TB

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF39604 series.pdf
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Product number: FWF39604-S12B22TB
Category: Wire to Board Connectors
Specification: Pitch:3.96mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 12Circuits
Status: Active
Description: Wafer 3.96mm 90°Angle 12Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2024-12-03
MPQ: 500
MOQ: 1000
Type: Wafer 3.96mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 3.96mm
Height 12.6mm
Electrical
Current - Maximum per Contact 6.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
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D-SUB 90°Angle Female 78Circuits(Black)
FDM0903-F0WS101W1K-B
Machined pin D-SUB Female 9Circuits
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Wire to board housing 3.96mm 12Circuits
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IDC 2mm 14Circuits(3 Assemblies)
Quantity Unit Price
1 $0.255002
10 $0.239874
50 $0.209618
100 $0.194490
500 $0.164234
1000 $0.122027
2500 $0.120355
5000 $0.118683
10000 $0.117012
25000 $0.115340

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Sales Drawings

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