FWF39615-S03B23W5M Wafer 3.96mm 90°Angle 3Circuits (SMT)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

FWF39615.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF39615-S03B23W5M
Category：	Wire to Board Connectors
Specification：	Pitch:3.96mm
Type：	Socket
Mounting Style：	SMT
Angle：	90° Angle
Circuits：	3Circuits
Status：	Active
Description：	Wafer 3.96mm 90°Angle 3Circuits (SMT)
Stock(pcs)：	0
Lead time：	Estimated delivery date 2026-02-12
MPQ：	300
MOQ：	1200
Type：	Wafer 3.96mm 90°Angle (SMT)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (SMT)
Pitch	3.96mm
Height	9.7mm
Electrical
Current - Maximum per Contact	7.00A
Voltage - Maximum	250V
Contact Resistance	20 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1500V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Brass
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	LCP UL94V-0