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FWF42003-D08B22TK

Product number: FWF42003-D08B22TK
Category: Wire to Board Connectors
Specification: Pitch:4.20mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 8Circuits
Status: Active
Description: Wafer 4.2mm 90°Angle 8Circuits(DIP)
Stock(pcs): 491
Lead time: 491 In stock
Estimated delivery date when out of stock 2025-04-18
MPQ: 1000
MOQ: 1000
Type: Wafer 4.2mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 4.2mm
Height 12.80mm
Electrical
Current - Maximum per Contact 7.00A
Voltage - Maximum 600V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -40℃+105℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
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Wire to board housing 2.5mm 6Circuits(Black)
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Pin Header 2.54mm 180°Vertical Double row 12Circuits(DIP)
FPH25452-D10S1154191240B
Pin Header 2.54mm ,Double row ,10Circuits ,180° Vertical(DIP) ,15μ" ,PA6T
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Pin Header 2.54mm 180°Vertical Single row 40Circuits(DIP)(1μ'')
Quantity Unit Price
1 $0.243608
10 $0.229156
50 $0.200252
100 $0.185800
500 $0.156896
1000 $0.116574
2500 $0.114977
5000 $0.113380
10000 $0.111783
25000 $0.110187

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