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FWF42003-D14B22TK

Product number: FWF42003-D14B22TK
Category: Wire to Board Connectors
Specification: Pitch:4.20mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 14Circuits
Status: Active
Description: Wafer 4.2mm 90°Angle 14Circuits(DIP)
Stock(pcs): 25
Lead time: 25 In stock
Estimated delivery date when out of stock 2025-04-18
MPQ: 500
MOQ: 1000
Type: Wafer 4.2mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 4.2mm
Height 12.80mm
Electrical
Current - Maximum per Contact 7.00A
Voltage - Maximum 600V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -40℃+105℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
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Quantity Unit Price
1 $0.390253
10 $0.368059
50 $0.323671
100 $0.301478
500 $0.257090
1000 $0.200571
2500 $0.197815
5000 $0.195058
10000 $0.192300
25000 $0.189544

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