FWF42003-D18B22TK Wafer 4.2mm 90°Angle 18Circuits(DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications：

Product specification.pdf

Sales Drawings：

FWF42003 Series.pdf

3D Models：

fwf42003-10_ref.stp

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

Export Page to PDF

Product number：	FWF42003-D18B22TK
Category：	Wire to Board Connectors
Specification：	Pitch:4.20mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	90° Angle
Circuits：	18Circuits
Status：	Active
Description：	Wafer 4.2mm 90°Angle 18Circuits(DIP)
Stock(pcs)：	20
Lead time：	20 In stock Estimated delivery date when out of stock 2025-04-12
MPQ：	500
MOQ：	1000
Type：	Wafer 4.2mm 90°Angle (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (DIP)
Pitch	4.2mm
Height	12.80mm
Electrical
Current - Maximum per Contact	7.00A
Voltage - Maximum	600V
Contact Resistance	10 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1500V AC r.m.s
Temperature Range operating	-40℃+105℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA66 UL94V-0