FWF42008-D18S22TK Wafer 4.2mm 180°Vertical 18Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications：

Product specification.pdf

Sales Drawings：

FWF42008 Series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

Export Page to PDF

Product number：	FWF42008-D18S22TK
Category：	Wire to Board Connectors
Specification：	Pitch:4.20mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	180°Vertical
Circuits：	18Circuits
Status：	Active
Description：	Wafer 4.2mm 180°Vertical 18Circuits (DIP)
Stock(pcs)：	100
Lead time：	100 In stock Estimated delivery date when out of stock 2025-08-11
MPQ：	500
MOQ：	1000
Type：	Wafer 4.2mm 180°Vertical (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 180°Vertical (DIP)
Pitch	4.2mm
Height	12.80mm
Electrical
Current - Maximum per Contact	9.00A
Voltage - Maximum	600V
Contact Resistance	10 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1500V AC r.m.s
Temperature Range operating	-40℃+105℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA66 UL94V-0