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FWF63501-S02S22TB

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF63501.pdf
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Product number: FWF63501-S02S22TB
Category: Wire to Board Connectors
Specification: Pitch:6.35mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 2Circuits
Status: Active
Description: Wafer 6.35mm 180°Vertical 2Circuits (DIP)
Stock(pcs): 76
Lead time: 76 In stock
Estimated delivery date when out of stock 2024-05-07
MPQ: 500
MOQ: 1000
Type: Wafer 6.35mm 180°Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 6.35mm
Height 14.7mm
Electrical
Current - Maximum per Contact 10.00A
Voltage - Maximum 600V
Contact Resistance 25 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 5000V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
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Ejector Box Header 2.54mm 14Circuits(Bump)
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Wafer 4.2mm 180°Vertical 2Circuits (DIP)
Quantity Unit Price
1 $0.226732
10 $0.213282
50 $0.186380
100 $0.172929
500 $0.146027
1000 $0.108499
2500 $0.107012
5000 $0.105526
10000 $0.104040
25000 $0.102554

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Sales Drawings

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