FWF63503-T09S22TB Wafer 6.35mm 180°Vertical 9Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

FWF63503 Series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF63503-T09S22TB
Category：	Wire to Board Connectors
Specification：	Pitch:6.35mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	180°Vertical
Circuits：	9Circuits
Status：	Active
Description：	Wafer 6.35mm 180°Vertical 9Circuits (DIP)
Stock(pcs)：	407
Lead time：	407 In stock Estimated delivery date when out of stock 2025-08-11
MPQ：	500
MOQ：	1000
Type：	Wafer 6.35mm 180°Vertical (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 180°Vertical (DIP)
Pitch	6.35mm
Height	14.73mm
Electrical
Current - Maximum per Contact	10.00A
Voltage - Maximum	600V
Contact Resistance	25 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	5000V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA66 UL94V-0