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FWF63509-S02B22W1K

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
Drawing-FWF63509.pdf
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Product number: FWF63509-S02B22W1K
Category: Wire to Board Connectors
Specification: Pitch:6.35mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 2Circuits
Status: Active
Description: Wafer 6.35mm 90°Angle 2Circuits (DIP)
Stock(pcs): 20
Lead time: 20 In stock
Estimated delivery date when out of stock 2024-12-03
MPQ: 500
MOQ: 1000
Type: Wafer 6.35mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 6.35mm
Height 17.27mm
Electrical
Current - Maximum per Contact 15.00A
Voltage - Maximum 600V
Contact Resistance 3.5 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 5000V AC r.m.s
Temperature Range operating -40℃+105℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
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FWF08001-S11S14W5M
Wafer 0.80mm 180°Vertical 11Circuits (SMT)
FWF20009-S11S22W1B
Wafer 2mm 180°Vertical 11Circuits (DIP)
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Quantity Unit Price
1 $0.915356
10 $0.864559
50 $0.762965
100 $0.712168
500 $0.610574
1000 $0.487786
2500 $0.481058
5000 $0.474330
10000 $0.467602
25000 $0.460874

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Sales Drawings

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