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FWF63509-S03B22W1K

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
Drawing-FWF63509.pdf
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Product number: FWF63509-S03B22W1K
Category: Wire to Board Connectors
Specification: Pitch:6.35mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 3Circuits
Status: Active
Description: Wafer 6.35mm 90°Angle 3Circuits (DIP)
Stock(pcs): 40
Lead time: 40 In stock
Estimated delivery date when out of stock 2024-12-03
MPQ: 500
MOQ: 1000
Type: Wafer 6.35mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 6.35mm
Height 17.27mm
Electrical
Current - Maximum per Contact 15.00A
Voltage - Maximum 600V
Contact Resistance 3.5 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 5000V AC r.m.s
Temperature Range operating -40℃+105℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
F0CM12-SA05PSW0-0001
M12X1.0 Socket ,A-Coded ,5Circuits ,Pin ,180° Vertical ,Soldering ,
FBB04004-F30S1003K6M
Board to Board 180°Vertical 0.4mm 30Circuits
FFC05007-27SSB224W5M
FPC/FFC connector 0.5mm 27Circuits(SMT)
FPH12701-S23S100422B
Pin Header 1.27mm 180°Vertical Single row 23Circuits(DIP)
FWF25030-S04B25W5M
Wafer 2.5mm 90°Angle 4Circuits (SMT)
FWF50801-S04S22TB
Wafer 5.08mm 180°Vertical 4Circuits (DIP)
Quantity Unit Price
1 $1.094274
10 $1.034185
50 $0.914007
100 $0.853918
500 $0.733740
1000 $0.590671
2500 $0.582495
5000 $0.574320
10000 $0.566145
25000 $0.557969

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Sales Drawings

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