你当前的浏览器版本过低或不支持。请升级或更换浏览器。推荐浏览器 Chrome Edge。

FWF63509-S05B22W1K

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
Drawing-FWF63509.pdf
Export Page to PDF
Product number: FWF63509-S05B22W1K
Category: Wire to Board Connectors
Specification: Pitch:6.35mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 5Circuits
Status: Active
Description: Wafer 6.35mm 90°Angle 5Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2024-12-03
MPQ: 500
MOQ: 1000
Type: Wafer 6.35mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 6.35mm
Height 17.27mm
Electrical
Current - Maximum per Contact 15.00A
Voltage - Maximum 600V
Contact Resistance 3.5 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 5000V AC r.m.s
Temperature Range operating -40℃+105℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
FFH25424-D24S1004K6K
Female Header 2.54mm ,Double row ,24Circuits ,180° Vertical(DIP) ,PA6T
FHG25403-S14M2K6B
Wire to board housing 2.54mm 14Circuits(Black)
FHG41404-D04F2W1B
Wire to board housing 4.14mm ,Double row ,4Circuits ,PA66
FID20004-184K6K
IDC 2.0mm 18Circuits(3 Assemblies)
FPH12701-S11S100424B
Pin Header 1.27mm 180°Vertical Single row 11Circuits(DIP)
FWF12506-S15S24W5L
Wafer 1.25mm 180°Vertical 15Circuits (DIP)

Sales Drawings

Product number: {{currentProduct.code}}
Product information: {{currentProduct.descCn}}
Order quantity: {{currentProduct.num}}
Cart ({{myCartItems.length}}Item)
Total amount:
{{isCn?'¥':'$'}}{{cartProductTotal}}
New Version Notification
This page has been discontinued and no longer supports purchasing. Please visit the new version page for selection and purchase
Go immediately