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FWF63509-S05B22W1K

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
Drawing-FWF63509.pdf
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Product number: FWF63509-S05B22W1K
Category: Wire to Board Connectors
Specification: Pitch:6.35mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 5Circuits
Status: Active
Description: Wafer 6.35mm 90°Angle 5Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2025-04-15
MPQ: 500
MOQ: 1000
Type: Wafer 6.35mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 6.35mm
Height 17.27mm
Electrical
Current - Maximum per Contact 15.00A
Voltage - Maximum 600V
Contact Resistance 3.5 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 5000V AC r.m.s
Temperature Range operating -40℃+105℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
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Female Header 1.27mm 180°Vertical Single Row 24Circuits(DIP)
FHG20005-S02M2W1B
Wire to board housing 2mm 2Circuits
FPH20001-S03S101434B
Pin Header 2mm 180°Vertical Single row 3Circuits(DIP)(1μ'')
FPH25452-D36S1014193540B
Pin Header 2.54mm ,Double row ,36Circuits ,180° Vertical(DIP) ,1μ" ,PA6T
FWF30005-S09B22K6B
Wafer 3mm 90°Angle 9Circuits(DIP)

Sales Drawings

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