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FWF63509-S06B22W1K

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
Drawing-FWF63509.pdf
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Product number: FWF63509-S06B22W1K
Category: Wire to Board Connectors
Specification: Pitch:6.35mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 6Circuits
Status: Active
Description: Wafer 6.35mm 90°Angle 6Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2024-12-03
MPQ: 500
MOQ: 1000
Type: Wafer 6.35mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 6.35mm
Height 17.27mm
Electrical
Current - Maximum per Contact 15.00A
Voltage - Maximum 600V
Contact Resistance 3.5 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 5000V AC r.m.s
Temperature Range operating -40℃+105℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
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Female Header 2.54mm 90°Angle Single row 2Circuits(DIP)
FPH20047-D20S1014350730B
Pin Header 2.00mm ,Double row ,20Circuits ,180° Vertical(DIP) ,1μ" ,PA6T
FPH25401-S02S101412B
Pin Header 2.54mm 180°Vertical Single row 2Circuits(DIP)(1μ'')
FPH25440-T18S101402B
Pin Header 2.54mm ,Three row ,18Circuits ,180° Vertical ,1μ" ,PA6T
FWF25013-S11B22W1B
Wafer 2.5mm 90°Angle 11Circuits (DIP)

Sales Drawings

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