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FWF63509-S07B22W1K

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
Drawing-FWF63509.pdf
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Product number: FWF63509-S07B22W1K
Category: Wire to Board Connectors
Specification: Pitch:6.35mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 7Circuits
Status: Active
Description: Wafer 6.35mm 90°Angle 7Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2025-01-02
MPQ: 500
MOQ: 1000
Type: Wafer 6.35mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 6.35mm
Height 17.27mm
Electrical
Current - Maximum per Contact 15.00A
Voltage - Maximum 600V
Contact Resistance 3.5 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 5000V AC r.m.s
Temperature Range operating -40℃+105℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
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FPH20022-D14B100404B
Pin Header 2mm 90°Angle Double row 14Circuits(DIP)
FPH25471-D40S1014190709M
Pin Header 2.54mm ,Double row ,40Circuits ,180° Vertical(SMT) ,1μ" ,PA6T
FPH254E1-S12S101448B
Pin Header 2.54mm 180°Vertical Single row 12Circuits(DIP)(1μ'')
FWF25405-S04B12K6B
Wafer 2.54mm 90°Angle 4Circuits (DIP)
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Wafer 3mm 180°Vertical 8Circuits (SMT)

Sales Drawings

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