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FWF63509-S08B22W1K

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
Drawing-FWF63509.pdf
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Product number: FWF63509-S08B22W1K
Category: Wire to Board Connectors
Specification: Pitch:6.35mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 8Circuits
Status: Active
Description: Wafer 6.35mm 90°Angle 8Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2025-04-14
MPQ: 500
MOQ: 1000
Type: Wafer 6.35mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 6.35mm
Height 17.27mm
Electrical
Current - Maximum per Contact 15.00A
Voltage - Maximum 600V
Contact Resistance 3.5 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 5000V AC r.m.s
Temperature Range operating -40℃+105℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
FCW002-000218
Multi-Conductor Cable: T42001-F2H-1 TO TINNED 3mm L=1000mm
FFH12718-D40S1004K6K
Female Header 1.27mm ,Double row ,40Circuits ,180° Vertical(SMT) ,PA6T
FPH25401-S03S100476B
Pin Header 2.54mm 180°Vertical Single row 3Circuits(DIP)
FPH25422-D60B100401B
Pin Header 2.54mm 90°Angle Double row 60Circuits(DIP)
FWF12510-S05B14W5M-B
Wafer 1.25mm 90°Angle 5Circuits (SMT)
FWF25013-S04B22W1B
Wafer 2.5mm 90°Angle 4Circuits (DIP)

Sales Drawings

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