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Building Technology Cornerstone

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Series image: for reference only

FWF12506 Wafer 1.25mm 180°Vertical (DIP)

Type： Wafer 1.25mm 180°Vertical (DIP)
EU RoHS： Compliant(2011/65/EU)
EU REACH： Dose not contain REACH SVHC(1907/2006/EC)
EU ELV： Compliant(2000/53/EC)
Specifications： Product specification.pdf
Sales Drawings： FWF12506 series.pdf
3D Models： FWF12506-S05_ref.rar
Catalogue： Wire to board connector catalog
Materials certifications： RoHS test report for Bronze Expand

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Specification

Product Specification

Category
Category	Wafer 180°Vertical (DIP)
Pitch	1.25mm
Height	4.7mm
Electrical
Current - Maximum per Contact	1.00A
Voltage - Maximum	125V
Contact Resistance	20 mΩ Max
Insulation Resistance	100 MΩ Min
Withstanding Voltage	250V AC r.m.s
Temperature Range operating	-25ºC~+85ºC
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA46 UL94V-0

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