FWF12506-S13S24W5B Wafer 1.25mm 180°Vertical 13Circuits (DIP)

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications：

Product specification.pdf

Sales Drawings：

FWF12506 series.pdf

3D Models：

FWF12506-S05_ref.rar

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

Export Page to PDF

Product number：	FWF12506-S13S24W5B
Category：	Wire to Board Connectors
Specification：	Pitch:1.25mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	180°Vertical
Circuits：	13Circuits
Status：	Active
Description：	Wafer 1.25mm 180°Vertical 13Circuits (DIP)
Stock(pcs)：	30
Lead time：	30 In stock Estimated delivery date when out of stock 2026-02-05
MPQ：	1000
MOQ：	1000
Type：	Wafer 1.25mm 180°Vertical (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 180°Vertical (DIP)
Pitch	1.25mm
Height	4.7mm
Electrical
Current - Maximum per Contact	1.00A
Voltage - Maximum	125V
Contact Resistance	20 mΩ Max
Insulation Resistance	100 MΩ Min
Withstanding Voltage	250V AC r.m.s
Temperature Range operating	-25ºC~+85ºC
Material and Plating
Material-Metal	Phosphor Bronze
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA46 UL94V-0