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FWF25005 Wafer 2.5mm 180°Vertical (DIP)

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Specification
Wafer 2.5mm 180°Vertical 2Circuits (DIP) Wafer 2.5mm 180°Vertical 3Circuits (DIP) Wafer 2.5mm 180°Vertical 4Circuits (DIP) Wafer 2.5mm 180°Vertical 5Circuits (DIP) Wafer 2.5mm 180°Vertical 6Circuits (DIP) Wafer 2.5mm 180°Vertical 7Circuits (DIP) Wafer 2.5mm 180°Vertical 8Circuits (DIP) Wafer 2.5mm 180°Vertical 9Circuits (DIP) Wafer 2.5mm 180°Vertical 10Circuits (DIP) Wafer 2.5mm 180°Vertical 11Circuits (DIP) Wafer 2.5mm 180°Vertical 12Circuits (DIP)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 2.5mm
Height 6.2mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0

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FWF25005 Wafer 2.5mm 180°Vertical (DIP)

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