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FWF25005-S11S22W1B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
Drawing-FWF25005.pdf
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Product number: FWF25005-S11S22W1B
Category: Wire to Board Connectors
Specification: Pitch:2.50mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 11Circuits
Status: Active
Description: Wafer 2.5mm 180°Vertical 11Circuits (DIP)
Stock(pcs): 0
Lead time: Estimated delivery date 2025-04-15
MPQ: 1000
MOQ: 1000
Type: Wafer 2.5mm 180°Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (DIP)
Pitch 2.5mm
Height 6.2mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
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IDC 2.54mm 12Circuits(3 Assemblies)
FPH254F1-D04S100432B
Pin Header 2.54mm 180°Vertical Double row 4Circuits(DIP)
FWF20007-S10S22W5B
Wafer 2mm 180°Vertical 10Circuits (DIP)
FWF39604-S08B22TB
Wafer 3.96mm 90°Angle 8Circuits (DIP)
FWJL27-S19050RD-01
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Quantity Unit Price
1 $0.073670
10 $0.068683
50 $0.058709
100 $0.053722
500 $0.043748
1000 $0.026089
2500 $0.025734
5000 $0.025379
10000 $0.025024
25000 $0.024669

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Sales Drawings

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