Building Technology Cornerstone

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Building Technology Cornerstone

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FWF30005 Wafer 3mm 90°Angle (DIP)

Type： Wafer 3mm 90°Angle (DIP)
EU RoHS： Compliant(2011/65/EU)
EU REACH： Dose not contain REACH SVHC(1907/2006/EC)
EU ELV： Compliant(2000/53/EC)
Sales Drawings： FWF30005 Series.pdf
Catalogue： Wire to board connector catalog
Materials certifications： RoHS test report for Bronze Expand

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Specification

Product Specification

Category
Category	Wafer 90°Angle (DIP)
Pitch	3mm
Height	4.37mm
Electrical
Current - Maximum per Contact	5.00A
Voltage - Maximum	250V
Contact Resistance	10 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1500V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Brass
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PBT UL94V-0

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FWF30005 Wafer 3mm 90°Angle (DIP)

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