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FWF30005-S09B22K6B

Product number: FWF30005-S09B22K6B
Category: Wire to Board Connectors
Specification: Pitch:3.00mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 9Circuits
Status: Active
Description: Wafer 3mm 90°Angle 9Circuits(DIP)
Stock(pcs): 30
Lead time: 30 In stock
Estimated delivery date when out of stock 2025-04-19
MPQ: 1000
MOQ: 1000
Type: Wafer 3mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 3mm
Height 4.37mm
Electrical
Current - Maximum per Contact 5.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Brass
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PBT UL94V-0
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Quantity Unit Price
1 $0.272539
10 $0.256371
50 $0.224035
100 $0.207866
500 $0.175529
1000 $0.130419
2500 $0.128632
5000 $0.126846
10000 $0.125059
25000 $0.123273

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