The TXGA FBB04009 series connector adopts a circular groove dual contact structure design. This design not only makes the contact arrangement more compact, effectively saving valuable equipment space, but also ensures that the connector can maintain structural stability in the face of external impact. In addition, the terminals have undergone gold plating treatment, which not only improves their conductivity but also enhances their corrosion resistance, providing strong guarantees for the reliability of electrical connections.
performance parameter
Current carrying capacity: up to 0.3A maximum
Voltage withstand: up to 60V
Contact resistance: 90m Ω Max
Insulation resistance: 100M Ω Min
Product advantages
Compact and stable: The annular groove dual contact structure makes the contact arrangement more compact while enhancing structural stability
Ultra thin design: The product combination height is only 0.8mm, suitable for extremely narrow space requirements
Advanced technology: Adopting SMT surface mount technology to improve production efficiency and connection reliability
Wide temperature operation: supports working environments ranging from -55 º C to+85 º C, suitable for various harsh application scenarios
Specification and Model
The pin spacing is 0.4mm and there are multiple models available, including 10 core, 24 core, 30 core, and 40 core, to meet different design requirements.
Industry Applications
With its excellent performance and compact design, the TXGA FBB04009 series connector has been widely used in high-precision and highly integrated electronic products such as mobile phone LCDs, OLED displays, mobile phone motherboards, camera modules, and earpiece components.
