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FHG12507-S08M2W1B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
FHG12507 Series.pdf
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Product number: FHG12507-S08M2W1B
Category: Wire to Board Connectors
Specification: Pitch:1.25mm
Type: Plug
Mounting Style: Crimp Housings
Angle: 180°Vertical
Circuits: 8Circuits
Status: Active
Description: Wire to board housing 1.25mm 8Circuits
Stock(pcs): 471
Lead time: 471 In stock
Estimated delivery date when out of stock {{2026-03-27|timezoneDate}}
MPQ: 1000
MOQ: 1000
Type: Wire to board housing 1.25mm
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wire to board housing
Pitch 1.25mm
Temperature Range operating -25ºC~+85ºC
Material and Plating
Material - Resin PA66 UL94V-0
FCW001-000961
Single Conductor Cable:HG42002-4P TO HG25009-4P L=170mm
FHG30004-S06F2K6B
Wire to board housing 3mm ,6Circuits
FPH127E1-S06S100401B
Pin Header 1.27mm 180°Vertical Single row 6Circuits(DIP)
FPH254E1-S13S100410B
Pin Header 2.54mm 180°Vertical Single row 13Circuits(DIP)
FPH254F1-D14S100130B
Pin Header 2.54mm 180°Vertical Double row 14Circuits(DIP)
FWF20005-D08S22W5B
Wafer 2mm 180°Vertical, 8Circuits (DIP)
Quantity Unit Price
1+ {{0.454743|tr}}
10+ {{0.423959|tr}}
50+ {{0.362391|tr}}
100+ {{0.331608|tr}}
500+ {{0.270041|tr}}

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Specifications

Sales Drawings

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