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FHG12507-S08M2W1B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
FHG12507 Series.pdf
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Product number: FHG12507-S08M2W1B
Category: Wire to Board Connectors
Specification: Pitch:1.25mm
Type: Plug
Mounting Style: Crimp Housings
Angle: 180°Vertical
Circuits: 8Circuits
Status: Active
Description: Wire to board housing 1.25mm 8Circuits
Stock(pcs): 471
Lead time: 471 In stock
Estimated delivery date when out of stock 2026-02-11
MPQ: 1000
MOQ: 1000
Type: Wire to board housing 1.25mm
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wire to board housing
Pitch 1.25mm
Temperature Range operating -25ºC~+85ºC
Material and Plating
Material - Resin PA66 UL94V-0
FBH20005-D30B1004K6K
Ejector Box Header 2mm 90°Angle 30Circuits(DIP)
FBH25401-D20S1004K6K
Box Header 2.54mm 180°Vertical 20Circuits(DIP)
FBH25419-D14S1004K6B01
Box Header 2.54mm 180°Vertical 14Circuits(DIP)
FWF08001-S09S13W5M
Wafer 0.80mm ,9Circuits ,180° Vertical(SMT) ,Gold ,LCP
FWF25001-S16S22W1B
Wafer 2.5mm 180°Vertical 16Circuits (DIP)
FWF39601-S08S22W1B-E36
Wafer 3.96mm 180°Vertical 8Circuits (DIP) (Canceled No.3,6Circuits)
Quantity Unit Price
1+ ¥0.454743
10+ ¥0.423959
50+ ¥0.362391
100+ ¥0.331608
500+ ¥0.270041

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Specifications

Sales Drawings

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