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FWF12520-S04S23NAM

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF12520-S04S23NAM.pdf
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Product number: FWF12520-S04S23NAM
Category: Wire to Board Connectors
Specification: Pitch:1.25mm
Type: Socket
Mounting Style: SMT
Angle: 180°Vertical
Circuits: 4Circuits
Status: Active
Description: Wafer 1.25mm ,4Circuits ,180° Vertical(SMT) ,PA9T
Stock(pcs): 1794
Lead time: 1794 In stock
Estimated delivery date when out of stock 2026-01-23
MPQ: 1000
MOQ: 1
Type: Wafer 1.25mm 180°Vertical (SMT)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180°Vertical (SMT)
Pitch 1.25mm
Height 5.3mm
Electrical
Current - Maximum per Contact 1.00A
Voltage - Maximum 125V
Contact Resistance 20 mΩ Max
Insulation Resistance 100 MΩ Min
Withstanding Voltage 250V AC r.m.s
Temperature Range operating -40ºC~+85ºC
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA9T UL94V-0
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Board to Board 0.5mm ,FEMALE ,40Circuits ,180° Vertical(SMT)
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Ejector Box Header 2.54mm 180°Vertical 34Circuits(DIP)(1μ'')
FFC05012-16SSB124W5M
FPC/FFC connector 0.5mm 16Circuits(SMT)
FFC10001-26SBA124W5M
FPC/FFC connector 1mm UpperContact 26Circuits(H2.7)(SMT)
FPH127F1-D40S100403B
Pin Header 1.27mm 180°Vertical Double row 40Circuits(DIP)
FWF42004-D18B22TK
Wafer 4.2mm 90°Angle 18Circuits (DIP)
Quantity Unit Price
1+ $0.459107
10+ $0.432998
50+ $0.380778
100+ $0.354669
500+ $0.302449

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Sales Drawings

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