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FWF25019-S04B24W5B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
FWF25019 series.pdf
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Product number: FWF25019-S04B24W5B
Category: Wire to Board Connectors
Specification: Pitch:2.50mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 4Circuits
Status: Discontinued
Description: Wafer 2.5mm 90°Angle 4Circuits (DIP)(6T)
Stock(pcs): 0
Lead time: Estimated delivery date 2025-01-04
MPQ: 1000
MOQ: 1
Type: Wafer 2.5mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 2.5mm
Height 5.7mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1000V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Brass
Material - Plating Mating Gold/Tin
Material - Plating Termination Gold/Tin
Material - Resin PA66 UL94V-0
FBB05002-M34S1003K6MH20
Board to Board 180°Vertical 0.5mm 34Circuits(H2=2mm)
FFH12703-D12S1004K6K
Female Header 1.27mm ,Double row ,12Circuits ,180° Vertical(DIP) ,PA6T
FFH12713-D16S1004K6K
Female Header 1.27mm 180°Vertical Double row 16Circuits(SMT)
FHG62006-T12M2TB
Wire to board housing 6.2mm 12Circuits
FID12707-164R1M
Micro match 1.27mm 180°Vertical 16Circuits(SMT)
FMP14-100B
4P4C Modular Plug, Gold Flash

Specifications

Sales Drawings

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