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FWF25019 Wafer 2.5mm 90°Angle (DIP)

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Specification
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Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 2.5mm
Height 5.7mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1000V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Brass
Material - Plating Mating Gold/Tin
Material - Plating Termination Gold/Tin
Material - Resin PA66 UL94V-0

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FWF25019 Wafer 2.5mm 90°Angle (DIP)

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