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FWF30019-D18B23K6M

Product number: FWF30019-D18B23K6M
Category: Wire to Board Connectors
Specification: Pitch:3.00mm
Type: Socket
Mounting Style: SMT
Angle: 90° Angle
Circuits: 18Circuits
Status: Active
Description: Wafer 3mm 90°Angle 18Circuits (SMT)
Stock(pcs): 30
Lead time: 30 In stock
Estimated delivery date when out of stock 2025-04-19
MPQ: 1000
MOQ: 1000
Type: Wafer 3mm 90°Angle (SMT)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (SMT)
Pitch 3.00mm
Height 9.91mm
Electrical
Current - Maximum per Contact 5.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin LCP UL94V-0
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Quantity Unit Price
1 $1.376525
10 $1.300937
50 $1.149761
100 $1.074173
500 $0.922997
1000 $0.743025
2500 $0.732741
5000 $0.722457
10000 $0.712173
25000 $0.701889

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