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FWF80002-S01S22GYB

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF80002 Series.pdf
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Product number: FWF80002-S01S22GYB
Category: Wire to Board Connectors
Specification: Pitch:8.00mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 1Circuit
Status: Active
Description: Wafer 10-8mm ,1Circuit ,180° Vertical(DIP) ,Gray
Stock(pcs): 0
Lead time: Estimated delivery date 2025-05-11
MPQ: 1000
MOQ: 1000
Type: Wafer 10-8mm 180° Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180° Vertical (DIP)
Pitch 8.0mm
Height 16.5mm
Electrical
Current - Maximum per Contact 5.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Brass
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
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Board to Board 180°Vertical 0.8mm 12Circuits(H1=3mm)
FHG25012-S04M2W1B
Wire to board housing 2.5mm 4Circuits
FLV05004-30WS01033BKK
LVDS 0.5mm ,30Circuits ,Soldering ,0.075μm(3 Assemblies)
FPH25448-S06S1154191240B
Pin Header 2.54mm ,Single row ,6Circuits ,180° Vertical(DIP) ,15μ" ,PA6T
FT12507-F2H
Wire to board terminal 1.25mm Female(Tin-Plated)
Quantity Unit Price
1 $0.026783
10 $0.024970
50 $0.021344
100 $0.019531
500 $0.015905
1000 $0.009485
2500 $0.009356
5000 $0.009227
10000 $0.009098
25000 $0.008969

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Sales Drawings

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