Building Technology Cornerstone

中文 / English

Building Technology Cornerstone

中文 / English

你当前的浏览器版本过低或不支持。请升级或更换浏览器。推荐浏览器 Chrome Edge。

谷歌Chrome

Edge浏览器

Series image: for reference only

FWF80002 Wafer 10-8mm 180° Vertical (DIP)

Type： Wafer 10-8mm 180° Vertical (DIP)
EU RoHS： Compliant(2011/65/EU)
EU REACH： Dose not contain REACH SVHC(1907/2006/EC)
EU ELV： Compliant(2000/53/EC)
Sales Drawings： FWF80002 Series.pdf
Catalogue： Wire to board connector catalog
Materials certifications： RoHS test report for Bronze Expand

ViewProduct Specification

Export Page to PDF

Specification

Product Specification

Category
Category	Wafer 180° Vertical (DIP)
Pitch	8.0mm
Height	16.5mm
Electrical
Current - Maximum per Contact	5.00A
Voltage - Maximum	250V
Contact Resistance	10 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1500V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Brass
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA66 UL94V-0

New Product Express

x

{{concat.title}}Product：{{concat.code}}

Content{{concat.content}}

(+86)755-28100190
sales@txga.com
Chat {{concat.content}}
Leave a massage {{concat.content}}

EnquireTXGA✕

Relevant Products

FWF80002 Wafer 10-8mm 180° Vertical (DIP)

Copy to my email address：{{encryptEmail}}

>Copy to my email address：Please move to personal center to bind your email address first

Please enter customer part number. ✕

Don’t show this pop up window next time

No need

Confirm

New Version Notification

This page has been discontinued and no longer supports purchasing. Please visit the new version page for selection and purchase

Go immediately