FWF80002-S03S22GYB Wafer 10-8mm ,3Circuits ,180° Vertical(DIP) ,Gray

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings：

FWF80002 Series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

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Product number：	FWF80002-S03S22GYB
Category：	Wire to Board Connectors
Specification：	Pitch:8.00mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	180°Vertical
Circuits：	3Circuits
Status：	Active
Description：	Wafer 10-8mm ,3Circuits ,180° Vertical(DIP) ,Gray
Stock(pcs)：	0
Lead time：	Estimated delivery date 2025-04-20
MPQ：	1000
MOQ：	1000
Type：	Wafer 10-8mm 180° Vertical (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 180° Vertical (DIP)
Pitch	8.0mm
Height	16.5mm
Electrical
Current - Maximum per Contact	5.00A
Voltage - Maximum	250V
Contact Resistance	10 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1500V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Brass
Material - Plating Mating	Tin
Material - Plating Termination	Tin
Material - Resin	PA66 UL94V-0