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FWF80002-S05S22GYB

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF80002 Series.pdf
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Product number: FWF80002-S05S22GYB
Category: Wire to Board Connectors
Specification: Pitch:8.00mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 5Circuits
Status: Active
Description: Wafer 10-8mm ,5Circuits ,180° Vertical(DIP) ,Gray
Stock(pcs): 0
Lead time: Estimated delivery date 2025-04-20
MPQ: 1000
MOQ: 1000
Type: Wafer 10-8mm 180° Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180° Vertical (DIP)
Pitch 8.0mm
Height 16.5mm
Electrical
Current - Maximum per Contact 5.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Brass
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
FBB10001-M64S7023W5M
Board to Board 1mm ,MALE ,64Circuits ,180° Vertical(SMT)
FFH25447-S02S1001K6K
Female Header 2.54mm ,Single row ,2Circuits ,180° Vertical(DIP) ,Gold flash ,PBT
FHG15001-S08M2W1B
Wire to board housing 1.50mm 8Circuits
FHG25006-S07M2W1B
Wire to board housing 2.5mm 7Circuits
FID12702-343K6K
IDC 1.27mm 34Circuits(3 Assemblies)
FWF08002-S05B24W5M
Wafer 0.80mm 90°Angle 5Circuits (SMT)
Quantity Unit Price
1 $0.105630
10 $0.098854
50 $0.085302
100 $0.078526
500 $0.064974
1000 $0.042974
2500 $0.042387
5000 $0.041800
10000 $0.041214
25000 $0.040627

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Sales Drawings

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