FWF25019-S13B22W1B Wafer 2.5mm ,13Circuits ,90° Angle(DIP) ,PA66

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The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications：

Product specification.pdf

Sales Drawings：

FWF25019 series.pdf

Catalogue：

Wire to board connector catalog

Materials certifications： Expand

RoHS test report for Bronze

Export Page to PDF

Product number：	FWF25019-S13B22W1B
Category：	Wire to Board Connectors
Specification：	Pitch:2.50mm
Type：	Socket
Mounting Style：	Through Hole
Angle：	90° Angle
Circuits：	13Circuits
Status：	Active
Description：	Wafer 2.5mm ,13Circuits ,90° Angle(DIP) ,PA66
Stock(pcs)：	0
Lead time：	Estimated delivery date 2024-11-22
MPQ：	1000
MOQ：	1000
Type：	Wafer 2.5mm 90°Angle (DIP)
EU RoHS：	Compliant(2011/65/EU)
EU REACH：	Dose not contain REACH SVHC(1907/2006/EC)
EU ELV：	Compliant(2000/53/EC)

Category
Category	Wafer 90°Angle (DIP)
Pitch	2.5mm
Height	5.7mm
Electrical
Current - Maximum per Contact	3.00A
Voltage - Maximum	250V
Contact Resistance	20 mΩ Max
Insulation Resistance	1000 MΩ Min
Withstanding Voltage	1000V AC r.m.s
Temperature Range operating	-25℃+85℃
Material and Plating
Material-Metal	Brass
Material - Plating Mating	Gold/Tin
Material - Plating Termination	Gold/Tin
Material - Resin	PA66 UL94V-0