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FWF25019-S13B22W1B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
FWF25019 series.pdf
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Product number: FWF25019-S13B22W1B
Category: Wire to Board Connectors
Specification: Pitch:2.50mm
Type: Socket
Mounting Style: Through Hole
Angle: 90° Angle
Circuits: 13Circuits
Status: Active
Description: Wafer 2.5mm ,13Circuits ,90° Angle(DIP) ,PA66
Stock(pcs): 0
Lead time: Estimated delivery date 2025-05-11
MPQ: 1000
MOQ: 1000
Type: Wafer 2.5mm 90°Angle (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 90°Angle (DIP)
Pitch 2.5mm
Height 5.7mm
Electrical
Current - Maximum per Contact 3.00A
Voltage - Maximum 250V
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1000V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Brass
Material - Plating Mating Gold/Tin
Material - Plating Termination Gold/Tin
Material - Resin PA66 UL94V-0
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Specifications

Sales Drawings

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