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FHG12507-S12M2W1B

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Specifications:
Product specification.pdf
Sales Drawings:
FHG12507 Series.pdf
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Product number: FHG12507-S12M2W1B
Category: Wire to Board Connectors
Specification: Pitch:1.25mm
Type: Plug
Mounting Style: Crimp Housings
Angle: 180°Vertical
Circuits: 12Circuits
Status: Active
Description: Wire to board housing 1.25mm 12Circuits
Stock(pcs): 0
Lead time: Estimated delivery date 2026-02-11
MPQ: 1000
MOQ: 1000
Type: Wire to board housing 1.25mm
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wire to board housing
Pitch 1.25mm
Temperature Range operating -25ºC~+85ºC
Material and Plating
Material - Resin PA66 UL94V-0
FBH25419-D64S1004K6B03
Box Header 2.54mm 180°Vertical 64Circuits(DIP)
FFC10028-19SBD224K6M
FPC/FFC connector 1mm Double contact 19Circuits(H3)(SMT)
FFC10054-07SBB123W5M
FPC/FFC connector 1mm (H2.05) ,7Circuits ,90° Angle(SMT) ,Bottom contact
FHG42002-D24F2TB
Wire to board housing 4.2mm 24Circuits
FWF25014-S08S22C1B
Wafer 2.5mm 180°Vertical 8Circuits (DIP)
FWF39601-S05S22W1B-E245
Wafer 3.96mm 180°Vertical 5Circuits (DIP) (Canceled No.2,4,5Circuits)
Quantity Unit Price
1+ ¥0.553624
10+ ¥0.518111
50+ ¥0.447081
100+ ¥0.411567
500+ ¥0.340538

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Specifications

Sales Drawings

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